发明名称 APPARATUS FOR TREATING SUBSTRATE AND PLASMA TREATING METHOD
摘要 The present invention relates to a substrate treatment system. More specifically, the purpose of the present invention is to provide a substrate treating apparatus which can enhance endpoint detection efficiency. According to an embodiment of the present invention, the substrate treatment system comprises a processing chamber carrying out processes using plasma; and a detection unit detecting an endpoint by performing optical analysis on the plasma in the processing chamber. In addition, the detection unit may includes: a photosensor; a first controller collecting spectrum data from the photosensor; and a second controller analyzing some of the data received from the first controller by automatically selecting the same.
申请公布号 KR20160033359(A) 申请公布日期 2016.03.28
申请号 KR20140123885 申请日期 2014.09.17
申请人 SEMES CO., LTD. 发明人 LEE, JONG SEOK
分类号 H01L21/3065;H01L21/66 主分类号 H01L21/3065
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