| 摘要 |
The present invention is to provide a wafer processing method which prevent generation of vibration to a cutting edge of a cutting blade and burr of a base forming a dicing tape when cutting a wafer with an adhesive film along a separation line using the cutting blade while attaching the adhesive film installed in the other side of the wafer to the surface of the dicing tape. The method of the present invention comprises: a step of preparing a plurality of separation lines on the surface thereof as a matrix; a step of dividing a wafer on which devices are formed in a plurality of areas by the plurality of separation lines into individual devices along the plurality of separation lines; and a step of installing adhesive films for die-bonding on the other side of the devices. The method includes: a wafer support step of attaching an adhesive layer cured by the irradiation of UV light on the adhesive layer of the dicing tape installed in the tape base; a UV irradiation step of curing the adhesive layer by irradiating the dicing tape with the UV light; and a cutting step of dividing the wafer into individual devices by rotating the cutting blade which has a cutting edge on the outer circumference and cutting the wafer with the adhesive film along the separation lines, wherein the cutting step inserts the cutting edge of the cutting blade into the cured adhesive layer. |
