发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
摘要 A printed circuit board and a manufacturing method thereof are disclosed. Provided are the printed circuit board which comprises: a core layer having a curved surface in at least a part of the core layer; an armature inserted inside the core layer to maintain the curved surface of the core layer; and a circuit formed in at least one surface of the core layer, and a manufacturing method thereof.
申请公布号 KR20160033527(A) 申请公布日期 2016.03.28
申请号 KR20140124561 申请日期 2014.09.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, SUNG HAN;KIM, EUN SIL;HONG, JIN HO;SHIN, SANG HYUN;LEE, KEUN YONG;PARK, NO IL;LEE, SA YONG;SHIN, MIN HO
分类号 H05K1/02;H05K3/28 主分类号 H05K1/02
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