PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
摘要
A printed circuit board and a manufacturing method thereof are disclosed. Provided are the printed circuit board which comprises: a core layer having a curved surface in at least a part of the core layer; an armature inserted inside the core layer to maintain the curved surface of the core layer; and a circuit formed in at least one surface of the core layer, and a manufacturing method thereof.
申请公布号
KR20160033527(A)
申请公布日期
2016.03.28
申请号
KR20140124561
申请日期
2014.09.18
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, SUNG HAN;KIM, EUN SIL;HONG, JIN HO;SHIN, SANG HYUN;LEE, KEUN YONG;PARK, NO IL;LEE, SA YONG;SHIN, MIN HO