发明名称 METHOD OF REDUCING ICING OF SUBSTRATE
摘要 FIELD: physics.SUBSTANCE: method can be used for reducing icing of a substrate, for example, windmill blade. Method comprises applying on a substrate curable film-forming compositions containing curing agent with isocyanate functional groups, and a film-forming polymer with reactive functional groups with respect to isocyanate groups curing agent, and polysiloxane in curable film-forming composition in an amount sufficient to reduce icing substrate under conditions contributing to formation of ice. Polysiloxane contains polydimethylsiloxane and at least two functional hydroxyl and/or amino group or polysiloxane contains at least one polysiloxane containing at least one functional group which is reactive with respect to functional groups, at least one other component curable film-forming composition, and at least one polysiloxane which is not reactive with respect to functional groups of other components of the curable film-forming composition. Film-forming composition can be applied directly on substrate surface or on primer coat and/or upper coating on substrate.EFFECT: technical result is providing, when curing, maximum average load on coated substrate of 450 N during testing for ice adhesion.11 cl, 2 tbl
申请公布号 RU2579065(C1) 申请公布日期 2016.03.27
申请号 RU20140126886 申请日期 2012.11.30
申请人 PPG INDASTRIZ OGAJO, INK. 发明人 MORAVEK SKOTT DZH.;KONNELLI BRJUS A.;RAKIEVICH EDVARD F.;SHVARTTSMILLER DAVINA DZH.;ZALICH MAJKL A.
分类号 C09D5/00;C09D133/04;C09D167/00;C09D175/04;C09D183/04;C09K3/18 主分类号 C09D5/00
代理机构 代理人
主权项
地址