| 摘要 |
FIELD: electronic equipment.SUBSTANCE: invention is intended to create discrete devices and microwave integrated circuits with the help of field-effect transistors. Method of making field-effect transistor, including creation of drain and source contacts on the contact layer of semiconductor structure and extraction of active region, metal or metal and dielectric mask is applied directly on the surface of contact layer, formation of submicron slot in the mask for further etching operations of contact layer etching and application of T-shaped gate metal through resist mask, after application of the first metal mask lithography for opening windows is carried out when one of the edges coincides with location of Schottky gates in manufactured transistor, and after opening windows the second metal or dielectric mask is applied on the whole surface, remove resist and by lithography create window in resist surrounding slits formed between two metals or between metal and dielectric, perform selective etching of contact layer, after which spray metal films to form T-shaped gates. As a result, edges of T-shaped gate heads on both sides resting on metal or metal and dielectric masks. Then, via selective etching the mask is removed from under the "wings" of T-shaped gate and from the surface of transistor active area. After that, the surface of transistor active area, containing drain, source contacts and Schottky gates, is coated with a passivating layer of dielectric so that under "wings" of T-shaped gate cavities are formed filled with vacuum or gas medium.EFFECT: technical result is production of gated with length less than 100 nm, as well as reduced thickness of the metal mask and elimination of intermediate layer of dielectric placed between the active region surface and mask.1 cl, 1 dwg |
