| 摘要 |
According to the present invention, a display device may comprise a display panel and a chip-on-film type operation chip package bonded to the display panel. The operation chip package may include: a film wherein an operation chip is mounted; a plurality of film lines formed on the film; and at least one dummy pattern which may be formed on the film and is formed between the film lines. The purpose of the present invention is to prevent a wire from being torn, when the chip-on-film type operation chip package is repaired. |
