| 摘要 |
A bearing apparatus and a semiconductor processing device. The bearing apparatus comprises a static chuck (101), a central temperature control unit, a peripheral temperature control unit and a peripheral component (102), wherein the central temperature control unit is arranged inside the static chuck (101) for adjusting the temperature of the central area of a workpiece (22) to be processed borne by the static chuck (100), the peripheral component is arranged surrounding a peripheral wall of the static chuck (101) and comprises a focusing ring (23), a base ring (24) and an insulation ring (25) which are overlaid in sequence, and the peripheral temperature control unit is arranged inside the peripheral component for adjusting the temperature of the peripheral area of the workpiece (22) to be processed by means of heat exchange. The bearing apparatus can adjust the temperature of the peripheral area of the workpiece (22) to be processed, and thus it can compensate the temperature difference between the peripheral area and the central area of the workpiece (22) to be processed, thereby improving the technique uniformity. |
