SOLID STATE IMAGE PICKUP DEVICE AND SOLID STATE IMAGE PICKUP DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a solid state image pickup device which has high connection reliability between a pad and a circuit.SOLUTION: A solid state image pickup device which has a first semiconductor substrate on which a photoelectric conversion element is arranged on a surface and a second semiconductor substrate on which at least a part of a circuit for generating a signal based on charge of the photoelectric conversion element is arranged on a surface, and the first semiconductor substrate and the second semiconductor substrate are arranged in a manner such that the surface of the first semiconductor substrate and the surface of the second semiconductor substrate face each other, and comprises: a wiring structure arranged between the first semiconductor substrate and the second semiconductor substrate; and a pad having a first surface to which an external terminal is connected. The first surface of the pad includes the surface of the first semiconductor substrate and lies between a virtual plane parallel with the surface of the first semiconductor substrate and the surface of the second semiconductor substrate. A second surface of the pad opposite to the first surface lies between the first surface and the surface of the second semiconductor substrate and the second surface is connected to the wiring structure in a manner such that the pad is connected to a circuit arranged on the second semiconductor substrate via the wiring structure.SELECTED DRAWING: Figure 1