TRANSISTOR THERMAL AND EMI MANAGEMENT SOLUTION FOR FAST EDGE RATE ENVIRONMENT

摘要

An electronic device mounting technique in which insulative and thermal barrier materials used in combination with printed circuit board design produce higher electrical breakdown voltage while minimizing thermal resistance and electromagnetic interference.

主权项

1. An apparatus including an electronic device mounted on a circuit substrate for fast signal edge rate operation, comprising:
a metal member; a printed circuit substrate mechanically coupled to said metal member and including
an electrically insulative substrate with mutually opposed first and second substrate sides, anda first electrically conductive layer disposed on said first substrate side; and a semiconductor device including at least first and second electrodes with
said first electrode electrically coupled to a portion of said first electrically conductive layer, andsaid second electrode mechanically coupled via at least a layer of dielectric material to one or both of said printed circuit substrate and metal member.