| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer manufacturing method by which a wafer can be cut out flat.SOLUTION: In a second slice step ST22, processed waste that is more difficult to remove toward the central part of an ingot becomes easier to remove by virtue of swing, so that extra processing due to the processed waste is prevented, making it possible to cut out the central part of a wafer flat. In a first slice step ST21 and a third slice step ST23, compared to an area including the central part of the ingot, the area on both its sides are processed at a higher feed speed for processing or at a lower voltage, so that the processing start portion and processing end portion of the wafer can be cut out flat. Thus, all the surface of the wafer can be cut flat by swinging the ingot through the relative movement of wire and ingot and by adjusting the feed speed for processing and the voltage of the wire.SELECTED DRAWING: Figure 8 |
