发明名称 LED VERTICAL CHIP STRUCTURE WITH SPECIAL COARSENING MORPHOLOGY AND PREPARATION METHOD THEREFOR
摘要 A method for improving luminous efficiency of an LED in a vertical structure. First, an LED vertical chip structure with a special coarsening morphology is provided, and micron-scale holes (311) are formed in the surface of an epitaxial structure layer (300) and submicron-scale holes (312) are formed at the bottom of the micron-scale holes. The light emitting surface structure can increase the emission probability of light inside a device, and can greatly improve the light emission efficiency. Also provided is a preparation method for the chip structure. Micron-scale holes (311) are formed in an epitaxial structure layer (300) by stripping a growth substrate (100) with micron-scale bumps, and submicron-scale holes (312) are formed at the bottom of the micron-scale holes (311) by means of etching. The method is simple in process, can be applied to large-scale industrial production, and can greatly improve the luminous efficiency of the LED in the vertical structure.
申请公布号 WO2016041471(A1) 申请公布日期 2016.03.24
申请号 WO2015CN89497 申请日期 2015.09.14
申请人 ENRAYTEK OPTOELECTRONICS CO., LTD. 发明人 TONG, LING;ZHANG, QIONG;LV, MENGYAN;ZHANG, YU;LI, QIMING
分类号 H01L33/22;H01L33/00 主分类号 H01L33/22
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