发明名称 |
COMPOSITION FOR FORMING CONDUCTIVE PATTERNS AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN |
摘要 |
The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves. |
申请公布号 |
WO2016043540(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
WO2015KR09784 |
申请日期 |
2015.09.17 |
申请人 |
LG CHEM, LTD. |
发明人 |
CHOI, KWON IL;HAM, MYONG JO;LEE, EON SEOK;PARK, CHEOL-HEE;JEONG, HAN NAH;KIM, JAE HYUN;JUN, SHIN HEE;SEONG, EUN KYU |
分类号 |
H01B1/22;H01B5/14;H01B13/00 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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