| 摘要 |
The invention relates to a method for producing a circuit carrier unit (1, 2, 3, 4) which is deformable and/or back-moldable in the fitted state, having a polymeric circuit carrier film (1) and fitted (3) conductor tracks (2) disposed thereon. The invention further relates to a deformable and/or back-moldable circuit carrier unit (1, 2, 3, 4) when in the fitted state. According to the inventive method, a support layer (4) having receiving recesses for the circuit components (3) is created and is connected in a planar manner to the fitted circuit carrier (1, 2, 3) so that the circuit components (3) come to rest in the receiving recesses of the support layer (4). The resulting fitted circuit carrier unit (1, 2, 3, 4) can be used in conventional plastic processes for further processing, in particular deep-drawing and/or by means of film insert molding. After optional integration of transparent materials (7) and optical or lighting structures (8), back-molding, application of decorative layers (14) and/or coating layers, multifunctional plastic components, which are freely formed without seams, with electronic integration are obtained, in particular with an integrated touch sensor system and integrated display functions. |
