发明名称 |
LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The present disclosure relates to a lateral double-diffused metal oxide semiconductor transistor and a method for manufacturing the same. In the method, a high-voltage gate dielectric is formed at a surface of a semiconductor layer. A thin gate dielectric is formed above the substrate and has at least a portion adjacent to the high-voltage gate dielectric. A gate conductor is formed above the thin gate dielectric and the high-voltage gate dielectric. A first mask is used for patterning the gate conductor to define a first sidewall of the gate conductor above the thin gate dielectric. A second mask is used for patterning the gate conductor to define a second sidewall of the gate conductor at least partially above the high-voltage gate dielectric. Source and drain regions are formed to have a first doping type. The method further comprises doping through the first mask to form a body region of a second doping type. The second doping type is opposite to the first doping type. The method simplifies a manufacturer process and improves reliability of the resultant devices. |
申请公布号 |
US2016087081(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201514862453 |
申请日期 |
2015.09.23 |
申请人 |
Silergy Semiconductor Technology (Hangzhou) Ltd. |
发明人 |
You Budong;Wang Meng;Lyu Zheng |
分类号 |
H01L29/66;H01L29/78;H01L29/06;H01L29/08;H01L29/10 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a lateral double-diffused metal oxide semiconductor transistor, comprising:
forming a semiconductor layer of a first doping type; forming a high-voltage gate dielectric at a surface of said semiconductor layer; forming a thin gate dielectric above said semiconductor layer to have at least a portion adjacent to said high-voltage gate dielectric; forming a gate conduct above said thin gate dielectric and said high-voltage gate dielectric; forming a first sidewall of said gate conductor above said thin gate dielectric, by patterning said gate conductor through a first mask; forming a second sidewall of said gate conductor at least partially above said high-voltage gate dielectric, by patterning said gate conductor through a second mask; and forming source and drain regions of said first doping type, wherein said method further comprises forming a body region of a second doping type opposite to said first doping type by doping through said first mask. |
地址 |
Hangzhou CN |