发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE, IMAGE PICKUP SYSTEM USING SOLID-STATE IMAGE PICKUP DEVICE, AND METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE |
摘要 |
In a solid-state image pickup device including a pixel that includes a photoelectric conversion portion, a carrier holding portion, and a plurality of transistors, the solid-state image pickup device further includes a first insulating film disposed over the photoelectric conversion portion, the carrier holding portion, and the plurality of transistors, a conductor disposed in an opening of the first insulating film and positioned to be connected to a source or a drain of one or more of the plurality of transistors, and a light shielding film disposed in an opening or a recess of the first insulating film and positioned above the carrier holding portion. |
申请公布号 |
US2016086992(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201514957352 |
申请日期 |
2015.12.02 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Kato Aiko;Hashimoto Kouhei;Tamura Seiichi |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
|
代理人 |
|
主权项 |
1. A solid-state image pickup device comprising:
a pixel including: a photoelectric conversion portion, a carrier holding portion configured to hold carriers generated in the photoelectric conversion portion, and a plurality of transistors configured to output a signal based on the carriers in the carrier holding portion; a first insulating film disposed over the photoelectric conversion portion, the carrier holding portion, and the plurality of transistors; and a conductor disposed in an opening of the first insulating film and connected to a source or a drain of one or more of the plurality of transistors, wherein the solid-state image pickup device further comprises a light shielding film disposed in an opening or a recess of the first insulating film and positioned above the carrier holding portion. |
地址 |
Tokyo JP |