发明名称 |
PROXIMITY CONTACT COVER RING FOR PLASMA DICING |
摘要 |
Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly. |
申请公布号 |
WO2016043938(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
WO2015US47038 |
申请日期 |
2015.08.26 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HOLDEN, JAMES M.;LERNER, ALEXANDER N.;KUMAR, AJAY;IYER, APARNA;OUYE, ALAN HIROSHI |
分类号 |
H01L21/301;H01L21/3065;H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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