| 摘要 |
A light emitting device package for improving the reliability of wire bonding according to an embodiment includes a substrate, a conductive layer arranged on the substrate, at least one light emitting chip arranged on the substrate, a wire electrically connected to the conductive layer and the at least one light emitting chip, a wavelength conversion part arranged on the light emitting chip, and a molding part which surrounds the light emitting chip and the wire and is arranged on the substrate to expose the upper surface of the wavelength conversion part. A distance from the upper surface of the light emitting chip to the upper surface of the wavelength conversion part is longer than the sum of 37um and a distance from the upper surface of the light emitting chip to the highest point of the wire. |
