发明名称 COMPOUND MOLD
摘要 The present invention relates to a compound mold. In the compound mold comprising a lower mold and an upper mold installed in an upper part of the lower mold and ascends and descends; the lower mold (110) comprises: a lower die (111) where a number of work grooves are formed in parallel on an upper plane thereof, and a die supporting board (10) moving back and forth in a straight line along a longitudinal direction of the lower die by being combined to the upper part of the lower die (111). A press work is performed only at a work groove of the lower die (111) corresponding to the die supporting board (10). The present invention has a remarkable effect of being able to form a product by one mold; perform mass production; have high productivity with rapid processing speed; and reduces manufacturing costs by transferring a metal sheet material without a carrier or a bridge to transfer the metal sheet material.
申请公布号 KR101606324(B1) 申请公布日期 2016.03.24
申请号 KR20150094285 申请日期 2015.07.01
申请人 KIM, WON DO 发明人 KIM, WON DO
分类号 B21D28/14;B21D37/10 主分类号 B21D28/14
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