| 发明名称 |
Multi-Stacked Structures of Semiconductor Packages |
| 摘要 |
A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column. |
| 申请公布号 |
US2016086917(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514848415 |
申请日期 |
2015.09.09 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Byun Jae-Bum;Kwon Cheol;Yun Jong-Yun;Kong Do-II;Hur Sung-Chul |
| 分类号 |
H01L25/065;H01L23/02;H01L23/367;H01L23/498 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multi-stacked structure of semiconductor packages, comprising:
a plurality of substrates stacked in a vertical direction; semiconductor packages mounted on each substrate of the plurality of substrates; a heat release column extending substantially vertically through the plurality of the substrates, the heat release column overlapping at least one of the semiconductor packages serving as a heat generation source; and a heat dissipation part thermally connected to one end of the heat release column. |
| 地址 |
Suwon-si KR |
