| 发明名称 |
WAFER SLIP DETECTION DURING CMP PROCESSING |
| 摘要 |
A wafer-slip detection apparatus used in association with a chemical mechanical polishing (CMP) apparatus may include an imaging device that generates images corresponding to at least an area of a rotation table of the CMP apparatus, and an image processing unit coupled to the imaging device for receiving and processing the generated images during a CMP process. The image processing unit includes a reference image that is compared with each of the generated images for detecting a wafer presence within the at least an area of the rotation table, whereby the detected wafer presence is indicative of a wafer-slip event. |
| 申请公布号 |
US2016082566(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514958491 |
申请日期 |
2015.12.03 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Doughty John R.;Ghali Romany;Stevens Brian H. |
| 分类号 |
B24B37/005;G01S17/02;G06T7/00 |
主分类号 |
B24B37/005 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer-slip detection apparatus used in association with a chemical mechanical polishing (CMP) apparatus, the wafer-slip detection apparatus comprising:
an imaging device that generates images corresponding to at least an area of a rotation table of the CMP apparatus; and an image processing unit coupled to the imaging device for receiving and processing the generated images during a CMP process, the image processing unit including a reference image that is compared with each of the generated images for detecting a wafer presence within the at least an area of the rotation table, wherein the detected wafer presence is indicative of a wafer-slip event. |
| 地址 |
Grand Cayman KY |
