METHOD FOR MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED THEREBY

摘要

A method for manufacturing a wiring substrate which includes performing electroless plating on a substrate to be treated which has a via hole and/or trench while the substrate is immersed in an electroless plating solution, thereby embedding a plating metal in the via hole and/or trench, the method comprising at least the steps of: supplying the electroless plating solution below the substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied below the substrate; and causing the plating solution to overflow from above the substrate.