| 发明名称 |
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE |
| 摘要 |
An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer. |
| 申请公布号 |
US2016088737(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514806895 |
申请日期 |
2015.07.23 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
Iijima Shinya;ishizuki yoshikatsu |
| 分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a resin layer; a conductive layer buried in the resin layer; an electronic part buried in the resin layer; and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer. |
| 地址 |
Kawasaki-shi JP |
