发明名称 |
FinFET with Buried Insulator Layer and Method for Forming |
摘要 |
A fin structure suitable for a FinFET and having a buried insulator layer is disclosed. In an exemplary embodiment, a semiconductor device comprises a substrate with a first semiconductor material and having a fin structure formed thereupon. The fin structure includes a lower region proximate to the substrate, a second semiconductor material disposed on the lower region, a third semiconductor material disposed on the second semiconductor material, and an insulating material selectively disposed on the second semiconductor material such that the insulating material electrically isolates a channel region of the fin structure and further such that the insulating material exerts a strain on the channel region. The semiconductor device further comprises an isolation feature disposed adjacent to the fin structure. |
申请公布号 |
US2016087103(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201514949664 |
申请日期 |
2015.11.23 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Ching Kuo-Cheng;Wang Chao-Hsiung;Liu Chi-Wen;Chen Guan-Lin |
分类号 |
H01L29/78;H01L29/16;H01L29/06 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a substrate including a first semiconductor material and having a fin structure disposed thereupon, wherein the fin structure includes:
a lower region proximate to the substrate;a second semiconductor material disposed on the lower region;a third semiconductor material disposed on the second semiconductor material; andan insulating material selectively disposed on the second semiconductor material such that the insulating material electrically isolates a channel region of the fin structure and further such that the insulating material exerts a strain on the channel region; and an isolation feature disposed adjacent to the fin structure. |
地址 |
Hsin-Chu TW |