发明名称 FinFET with Buried Insulator Layer and Method for Forming
摘要 A fin structure suitable for a FinFET and having a buried insulator layer is disclosed. In an exemplary embodiment, a semiconductor device comprises a substrate with a first semiconductor material and having a fin structure formed thereupon. The fin structure includes a lower region proximate to the substrate, a second semiconductor material disposed on the lower region, a third semiconductor material disposed on the second semiconductor material, and an insulating material selectively disposed on the second semiconductor material such that the insulating material electrically isolates a channel region of the fin structure and further such that the insulating material exerts a strain on the channel region. The semiconductor device further comprises an isolation feature disposed adjacent to the fin structure.
申请公布号 US2016087103(A1) 申请公布日期 2016.03.24
申请号 US201514949664 申请日期 2015.11.23
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Ching Kuo-Cheng;Wang Chao-Hsiung;Liu Chi-Wen;Chen Guan-Lin
分类号 H01L29/78;H01L29/16;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device comprising: a substrate including a first semiconductor material and having a fin structure disposed thereupon, wherein the fin structure includes: a lower region proximate to the substrate;a second semiconductor material disposed on the lower region;a third semiconductor material disposed on the second semiconductor material; andan insulating material selectively disposed on the second semiconductor material such that the insulating material electrically isolates a channel region of the fin structure and further such that the insulating material exerts a strain on the channel region; and an isolation feature disposed adjacent to the fin structure.
地址 Hsin-Chu TW