发明名称 |
IMAGE SENSOR BENDING BY INDUCED SUBSTRATE SWELLING |
摘要 |
In some examples, techniques and architectures for fabricating an image sensor chip having a curved surface include placing a substrate on a first surface of an image sensor chip, wherein the first surface of the image sensor chip is opposite a second surface of the image sensor chip, and wherein the second surface of the image sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes modifying a volume of the substrate so as to impart forces on the image sensor chip to produce a curved image sensor chip. |
申请公布号 |
WO2016044040(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
WO2015US49277 |
申请日期 |
2015.09.10 |
申请人 |
MICROSOFT TECHNOLOGY LICENSING, LLC |
发明人 |
MCKNIGHT, GEOFFREY P.;VAJO, JOHN J.;GRAETZ, JASON A. |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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