DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE

摘要

The invention relates to a method for detaching a product substrate (6), which is connected to a carrier substrate (2) by a connecting layer (5) and which was processed on the carrier substrate (2), from the carrier substrate (2), the connecting layer (5) comprising an edge zone (3) having high adhesion and an anti-adhesion zone (14) arranged within the edge zone (3), characterized in that a peripheral segment (13) of the product substrate (6) arranged in the region of the edge zone (3) is severed from the product substrate (6) before the product substrate (4) is detached from the carrier substrate (2).