| 摘要 |
The present invention pertains to a pressure sensor module which is characterized by being provided with: a circuit board having a wiring conductor; an integrated circuit element disposed on a first surface of the circuit board and electrically connected to the wiring conductor; a pressure sensor element disposed on the first surface side of the circuit board and electrically connected to the integrated circuit element; and a lid body disposed on the first surface side of the circuit board to cover the integrated circuit element and the pressure sensor element and adhered to the circuit board. The pressure sensor module is further characterized in that the lid body has a through-hole communicating with the outer space and the inner space of the lid body such that a straight line connecting the outer space to the inner space through the inside of the through-hole without passing through the lid body exists, and such that a straight line connecting the outer space to the integrated circuit element through the inside of the through-hole without passing through the lid body does not exist. |
