FULL COLOR METHOD OF NOVEL SUBSTRATE PACKAGING LIGHT-EMITTING DIODE (LED)

摘要

A full color method of a substrate packaging LED comprises: a substrate (1); a circuit (2) arranged on the substrate, the circuit comprising a front face circuit (21) arranged on the front face of the substrate and a back face circuit (22) arranged on the back face of the substrate; a conductive hole (3) arranged in the substrate for connecting the front face circuit and the back face circuit, and the conductive hole extending from the front face circuit to the back face circuit, and filled, sealed and packed by conductive metal materials; LED light emitting chips (4) arranged on the front face circuit; packaging glue (5) for packaging the LED light emitting chips; the full color method of a substrate packaging LED includes: a. cleaning the substrate; b. unfreezing die bonding primer; c. uniformly expanding the distances among the LED light emitting chips, attaching the LED light emitting chips to the substrate through a die bonder and die bonding primer; d. connecting the LED light emitting chips attached to the substrate with a bonding pad on the substrate through a welding wire machine and bonding wires; e. compression molding of packaging glue and the front face of the substrate through a die manufacturing machine under a high temperature to protect the LED light emitting chips on the substrate.