APPARATUS AND METHOD FOR SINTERING ENCAPSULANT USING PHOSPHOR HEATING

摘要

The purpose of the present invention is to provide an apparatus and a method for curing an encapsulant using phosphor heating, capable of improving the curing speed of the encapsulant by irradiating the encapsulant in which a phosphor is mixed, with light having a predetermined wavelength, to induce heating of the phosphor. The apparatus according to the present invention comprises a light source module which is installed in a manufacturing device of an LED package, and irradiates an encapsulant layer in and to which a predetermined amount of phosphor is mixed and injected in the LED package, with light having a predetermined wavelength inducing self-heating of the phosphor, to cure the encapsulant through the heating of the phosphor. According to the present invention, the encapsulant in which the phosphor is mixed is irradiated with the light having the predetermined wavelength to induce heating of the phosphor, thereby rapidly curing the encapsulant. The curing time of the encapsulant is reduced to prevent the phosphor mixed by heat flow of the encapsulant from being precipitated or lumped. It is possible to improve color coordinates and brightness deviation among LED package products by preventing the mixed phosphor from being precipitated and lumped.