METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with a high electrical reliability.SOLUTION: A method includes the following steps of: preparing a lead frame that has a support substrate, a source lead 5 and a gate lead 6; arranging on the support substrate a semiconductor chip that comprises a power MOSFET and that has a principal surface, a source electrode pad 11 formed on the principal surface, and a gate electrode pad 12 formed on the principal surface; mutually and electrically connecting between the source lead and the source electrode pad via a first conductive member (a wire 14); and mutually and electrically connecting between the gate lead and the gate electrode pad via a second conductive member (a wire 15).SELECTED DRAWING: Figure 1