发明名称 |
METHOD OF MANUFACTURING A MEMS MICROPHONE |
摘要 |
A method of fabricating a micro electrical-mechanical system (MEMS) microphone on a substrate includes forming a sacrificial layer on a front surface of the substrate, forming a membrane within the sacrificial layer, forming a fixed plate on the sacrificial layer at a location corresponding to a location of the membrane, performing a laser cutting on the back surface of the substrate at a location corresponding to an edge region of the fixed plate until a surface of the sacrificial layer is expose to form an opening, forming a patterned photoresist layer on the back surface exposing a region within the boundary of the opening, removing a portion of the back surface using the patterned photoresist layer as a mask to form a cavity, and removing a portion of the sacrificial layer above and below the membrane to form an air gap between the membrane and the fixed plate. |
申请公布号 |
US2016088414(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201514849582 |
申请日期 |
2015.09.09 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
ZHENG CHAO;LI WEIGANG |
分类号 |
H04R31/00;H04R19/00;H04R19/04;B81C1/00 |
主分类号 |
H04R31/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a micro electromechanical system (MEMS) microphone, the method comprising:
providing a semiconductor substrate having a front surface and a back surface; forming a sacrificial layer on the front surface of the semiconductor substrate; forming a membrane within the sacrificial layer; forming a fixed plate on the sacrificial layer at a location corresponding to a location of the membrane; performing a laser cutting on the back surface of the semiconductor substrate at a location corresponding to an edge region of the fixed plate until a surface of the sacrificial layer is exposed to form an opening; forming a patterned photoresist layer on the back surface of the semiconductor substrate exposing a region within a boundary of the opening, removing a portion of the back surface of the semiconductor substrate using the patterned photoresist layer as a mask until the surface of the sacrificial layer is exposed to form a cavity; and removing a portion of the sacrificial layer disposed above and below a center region of the membrane to form an air gap between the membrane and the fixed plate. |
地址 |
Shanghai CN |