| 发明名称 |
Packaged MEMS Device and Method of Calibrating a Packaged MEMS Device |
| 摘要 |
A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element. |
| 申请公布号 |
US2016087606(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514961186 |
申请日期 |
2015.12.07 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Herzum Christian;Wurzer Martin;Helm Roland;Kropfitsch Michael;Barzen Stefan |
| 分类号 |
H03K3/01;H04R19/00;H04R19/04;H03G3/30 |
主分类号 |
H03K3/01 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for calibrating a packaged MEMS device, the method comprising:
measuring a resonance frequency of the packaged MEMS device; comparing the resonance frequency with a target resonance frequency of the packaged MEMS device; selecting values for at least one of a bias voltage and a signal processing gain; and storing the values in a memory element in the packaged MEMS device. |
| 地址 |
Neubiberg DE |
