发明名称 METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE FILM AND ELECTRICALLY CONDUCTIVE FILM
摘要 Provided is a method for producing an electrically conductive film including a coating film forming step of forming a coating film by applying an electrically conductive film forming composition including copper oxide particles, copper particles, and an organic compound having at least one functional group selected from the group consisting of a hydroxy group and an amino group and having a temperature at which a mass reduction rate when the film is heated at a temperature rising rate of 10° C./min is 50% within a range of 120° C. to 350° C. to a resin substrate, and an electrically conductive film forming step of forming an electrically conductive film containing metal copper by performing a heat treatment for heating the coating film to a heating temperature of 140° C. to 400° C. at a temperature rising rate of 30° C./min to 10,000° C./min, and an electrically conductive film.
申请公布号 US2016086688(A1) 申请公布日期 2016.03.24
申请号 US201514962441 申请日期 2015.12.08
申请人 FUJIFILM Corporation 发明人 HONGO Yushi;SASADA Misato;HAYATA Yuuichi
分类号 H01B1/22 主分类号 H01B1/22
代理机构 代理人
主权项 1. A method for producing an electrically conductive film comprising: a coating film forming step of forming a coating film by applying an electrically conductive film forming composition including copper oxide particles, copper particles, and an organic compound having at least one functional group selected from the group consisting of a hydroxy group and an amino group and having a temperature at which a mass reduction rate when the film is heated at a temperature rising rate of 10° C./min is 50% within a range of 120° C. to 350° C., to a resin substrate; and an electrically conductive film forming step of forming an electrically conductive film containing metal copper by performing a heat treatment for heating the coating film to a heating temperature of 140° C. to 400° C. at a temperature rising rate of 30° C./min to 10,000° C./min.
地址 Tokyo JP