发明名称 |
THERMALLY MANAGED ENCLOSURE |
摘要 |
An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing. Also, a method of thermal management within an enclosure includes transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resisting housing. The method further includes passively removing the heat from the explosion resistant housing. |
申请公布号 |
US2016088753(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
US201414494866 |
申请日期 |
2014.09.24 |
申请人 |
Hil Tech LLC dba Gtech USA |
发明人 |
Bell Kevin William;Andrews, Jr. James Dwight;Barnes Christipher Shannan |
分类号 |
H05K5/04;H05K7/20 |
主分类号 |
H05K5/04 |
代理机构 |
|
代理人 |
|
主权项 |
1. An enclosure comprising:
an explosion resistant housing having a back wall, a top, a first side, a second side, and a door; a transistor disposed on the back wall; a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing; an air circulation device disposed outside the explosion resistant housing and configured to move air over at least the passive heat exchanger; and an air shroud disposed over the explosion resistant housing, wherein at least a portion of the transistor is disposed on a plate and at least a portion of the transistor is disposed on the back wall. |
地址 |
Conroe TX US |