发明名称 THERMALLY MANAGED ENCLOSURE
摘要 An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing. Also, a method of thermal management within an enclosure includes transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resisting housing. The method further includes passively removing the heat from the explosion resistant housing.
申请公布号 US2016088753(A1) 申请公布日期 2016.03.24
申请号 US201414494866 申请日期 2014.09.24
申请人 Hil Tech LLC dba Gtech USA 发明人 Bell Kevin William;Andrews, Jr. James Dwight;Barnes Christipher Shannan
分类号 H05K5/04;H05K7/20 主分类号 H05K5/04
代理机构 代理人
主权项 1. An enclosure comprising: an explosion resistant housing having a back wall, a top, a first side, a second side, and a door; a transistor disposed on the back wall; a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing; an air circulation device disposed outside the explosion resistant housing and configured to move air over at least the passive heat exchanger; and an air shroud disposed over the explosion resistant housing, wherein at least a portion of the transistor is disposed on a plate and at least a portion of the transistor is disposed on the back wall.
地址 Conroe TX US