CHIP-TYPE CERAMIC SEMICONDUCTOR ELECTRONIC COMPONENT

摘要

Provided is a chip-type ceramic semiconductor electronic component wherein fluctuation of the change rate between resistance values prior to and after mounting is small. This chip-type ceramic semiconductor electronic component includes: a ceramic element including a ceramic semiconductor; a pair of first external electrodes formed on both end surfaces of the ceramic element, respectively; and a pair of second external electrodes, which cover the first external electrodes, respectively, and are formed to extend to a part of each of the side surfaces of the ceramic element. The second external electrodes contain a conductive agent, and a thermosetting resin that has been hardened at a temperature equal to or below 500°C.