| 摘要 |
Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent composition contains, as components, inorganic polishing particles, a polishing accelerator, and water. The inorganic polishing particles are alumina particles, the polishing accelerator is an organic carboxylic acid-based chelating compound, and the pH is 9.0-13.0. |
