| 摘要 |
The present invention provides a substrate processing apparatus and a substrate marking method, wherein the substrate processing apparatus has a function of marking the substrate by laser and is capable of shortening production time compared with the existing apparatus. The substrate processing apparatus (1) includes a substrate rotating unit (2) and a marking unit (3). The substrate rotating unit (2) ensures the substrate (90) to be supported in a mode that the surface (91) and the back face (92) of the substrate are all exposed, and the surface (91) and the back face (92) of the substrate (90) are faced upwards respectively by rotating the substrate (90) around a rotary axes (5); the marking unit (3) is configured to locate above the substrate rotating unit (2) and to be far from the rotary axes (5) of the substrate rotating unit (2) by at least a rotary radius, and performs two-dimension scanning by focus-adjustable laser to mark the substrate (90). |
