| 发明名称 |
ELECTRONIC DEVICE AND HEAT DISSIPATING CASING THEREOF |
| 摘要 |
An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium. |
| 申请公布号 |
US2016088762(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514594309 |
申请日期 |
2015.01.12 |
| 申请人 |
FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. ;Foxconn Technology Co., Ltd. |
发明人 |
WU JIA-HONG;DAI SHENG-LIANG |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dissipating casing configured to dissipate heat from an electronic component, the casing comprising:
top and bottom sides of the heat dissipating casing forming a sealed chamber; and a pore structure formed within the sealed chamber; wherein the sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium. |
| 地址 |
Kunshan CN |
