Chip Mounting

摘要

A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, and buffer layers having a Young's Modulus of 2.5 GPa or less.

主权项

1. A chip including a substrate defining one or more electronic devices and one or more solder elements located within the area of the chip and electrically connected to said one or more electronic devices, wherein the chip is provided with two impact resisting buffer layers between the substrate and the solder elements and a patterned conductive layer sandwiched between the said buffer layers for electrically connecting said one or more solder elements to said one or more electronic devices, said buffer layers each having a Young's Modulus in the range of 1.6 GPa to 2.4 GPa, wherein each of said two buffer layers has a thickness in the range of about 6.5 microns to about 10 microns.