| 发明名称 |
WIRING AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Wiring comprises a multilayer graphene including graphene sheets, an interlayer substance disposed between layers of the multilayer graphene, and an organic compound layer connected to a side surface of the multilayer graphene. The organic compound layer contains a photoisomerizable organic group connected to the multilayer graphene. |
| 申请公布号 |
US2016086890(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514842239 |
申请日期 |
2015.09.01 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
MIYAZAKI Hisao;SAKAI Tadashi |
| 分类号 |
H01L23/532;H01L21/768;H01L23/528 |
主分类号 |
H01L23/532 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Wiring comprising:
a multilayer graphene including graphene sheets; an interlayer substance disposed between layers of the multilayer graphene; and an organic compound layer connected to a side surface of the multilayer graphene, wherein the organic compound layer contains a photoisomerizable organic group connected to the multilayer graphene. |
| 地址 |
Minato-ku JP |
