| 发明名称 |
Electronic Component |
| 摘要 |
In an embodiment, an electronic component includes a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core layer, and a first conductive layer. The semiconductor die includes a first major surface and at least two conductive fingers arranged on the first major surface which are coupled to a common potential. The first conductive layer is arranged on, and electrically coupled to, the at least two conductive fingers and extends from the at least two conductive fingers over the first major surface of the dielectric core layer. |
| 申请公布号 |
US2016086881(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201414489707 |
申请日期 |
2014.09.18 |
| 申请人 |
lnfineon Technologies Austria AG |
发明人 |
Standing Martin |
| 分类号 |
H01L23/528;H01L29/20;H01L29/778 |
主分类号 |
H01L23/528 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, comprising:
a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core layer, the semiconductor die comprising a first major surface and at least two conductive fingers arranged on the first major surface which are coupled to a common potential, a first conductive layer arranged on, and electrically coupled to, the at least two conductive fingers and extending from the at least two conductive fingers over the first major surface of the dielectric core layer. |
| 地址 |
Villach AT |
