Multi-Stepped Boat Assembly for Receiving Semiconductor Packages

摘要

A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.

主权项

1. A multi-stepped boat assembly for receiving a semiconductor package, the multi-stepped boat assembly comprising:
a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package that is configured to be vertically stacked on the first semiconductor package in the stack hole; and a guide boat having at least one guide hole vertically aligned with the at least one stack hole, the guide boat being removably attachable to the stack boat, wherein an inner sidewall of the stack hole comprises:
a first step configured to receive the first semiconductor package; anda second step provided on the first step and configured to receive the second semiconductor package, wherein the guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.