发明名称 PRODUCTION METHOD FOR FIBER-REINFORCED COMPOSITE MATERIAL
摘要 A production method for a fiber-reinforced composite material comprises: a first step of stacking a prepreg including: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and a surface layer provided on at least one surface of the reinforcing fiber layer and containing polyamide resin particles having an average particle size of 5 to 50 μm and a melting point of 175 to 210° C. plurally and performing heating at a temperature of 120° C. or more and less than M1° C. when the melting point of the polyamide resin particles measured in the composition forming the surface layer is denoted by M1° C.; and a second step of performing heating at a temperature of M1° C. or more after the first step to cure the resin.
申请公布号 US2016083541(A1) 申请公布日期 2016.03.24
申请号 US201414780737 申请日期 2014.03.24
申请人 JX NIPPON OIL & ENERGY CORPORATION ;FUJI JUKOGYO KABUSHIKI KAISHA 发明人 FUKUDA Yoshihiro;MATSUMOTO Takayuki;MINAMI Masaki;SEKINE Naoyuki;NAKAJIMA Masanori
分类号 C08J5/24;C08J5/04 主分类号 C08J5/24
代理机构 代理人
主权项 1. A production method for a fiber-reinforced composite material comprising: a first step of stacking a prepreg including a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles having an average particle size of 5 to 50 μm and a melting point of 175 to 210° C. plurally and performing heating at a temperature of 120° C. or more and less than M1° C. when a melting point of the polyamide resin particles measured in the composition forming the surface layer is denoted by M1° C.; and a second step of performing heating at a temperature of M1° C. or more after the first step to cure the resin.
地址 Tokyo JP