CERAMIC PLATE STRUCTURE

摘要

A ceramic plate structure includes a first transmittance-enhancing film layer disposed between a substrate and a first binding film layer, a conductive film layer disposed between the first binding film layer and a second binding film layer, and a second transmittance-enhancing film layer disposed between the second binding film layer and a ceramic layer. The ceramic layer renders the ceramic plate structure satisfactory in terms of transmittance gain, thermal conductivity coefficient, electrical insulation, rigidity, resistance to wear and tear, and resistance to wind erosion of the ceramic plate structure. The ceramic plate structure is suitable for use with touch panels to therefore enhance the cost-effectiveness of the manufacturing process of touch panels by cutting its material costs, reducing its power consumption, and shortening its production cycle. Accordingly, the anticipated benefits and objectives of the ceramic plate structure are attained.

主权项

1. A ceramic plate structure, comprising:
a substrate (10), a first transmittance-enhancing film layer (20), a first binding film layer (30), a conductive film layer (40), a second binding film layer (50), a second transmittance-enhancing film layer (60), and a ceramic layer (70); wherein the substrate (10) is a glass plate; wherein the first transmittance-enhancing film layer (20) is disposed between the substrate (10) and the first binding film layer (30) and adapted to provide transmittance gain to the ceramic plate structure (1); wherein the conductive film layer (40) is disposed on and attached to the first binding film layer (30) and corresponds in position to the first transmittance-enhancing film layer (20) to effectuate electrical conduction of the ceramic plate structure (1); wherein the second binding film layer (50) is disposed on and attached to the conductive film layer (40) and corresponds in position to the first binding film layer (30); wherein the second transmittance-enhancing film layer (60) is disposed on and attached to the second binding film layer (50) and corresponds in position to the conductive film layer (40) to provide transmittance gain to the ceramic plate structure (1); wherein the ceramic layer (70) is disposed on and attached to the second transmittance-enhancing film layer (60) and corresponds in position to the second binding film layer (50) to augment transmittance gain, thermal conductivity coefficient, electrical insulation, rigidity, resistance to wear and tear, and resistance to wind erosion of the ceramic plate structure (1).