发明名称 DEVICE AND METHOD OF DRILLING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device and method of drilling a substrate, which can secure the quality of drilling machining by enabling a substrate pressing face to be easily and largely changed when drilling a substrate with a drill.SOLUTION: A device of drilling a substrate has, at a spindle part 4 for rotating a drill 3, an engagement part with which a substrate pressing part engages. In the device, two substrate pressing parts 9, 14 with substrate pressing faces of end portions different from each other are engaged by the engagement part with the spindle part 4 in a state of being stacked such that the end portion of one substrate pressing part 9 can pass through the central part of the end portion of the other substrate pressing part 14. The engagement part is operated selectively so that the end portion of the one substrate pressing part 9 protrudes from the central part of the end portion of the other substrate pressing part 14 to press a substrate 1 only by the end portion of the one substrate pressing part 9 or at least the end portion of the other substrate pressing part 14 presses the substrate 1.SELECTED DRAWING: Figure 1
申请公布号 JP2016040055(A) 申请公布日期 2016.03.24
申请号 JP20140164225 申请日期 2014.08.12
申请人 VIA MECHANICS LTD 发明人 WATAYO TAKASHI;KUMAGAI TOKUSHIGE
分类号 B26F1/16;B23B47/28 主分类号 B26F1/16
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