GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD

摘要

Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

主权项

1. A circuit board, comprising:
a substrate having a first end, a second end, and an extension section extending in an extension direction between the first end and the second end, the substrate having a predetermined substrate thickness, the substrate includes a component surface and a grounding surface; a plurality of high-frequency connection pads formed on the component surface at the first end of the substrate, each of said plurality of high-frequency connection pads being isolated from each other; a plurality of differential mode signal lines formed on the component surface of the substrate, each of said plurality of differential mode signal lines being isolated from each other and respectively connected to adjacent ones of the plurality high-frequency connection pads, the plurality of differential mode signal lines transmitting at least a high-frequency differential mode signal; a connector mounded on the component surface of the substrate, including a plurality of high-frequency signal terminals respectively soldered to the high-frequency connection pads; the grounding surface of the substrate comprising a grounding layer formed at a location aligning and corresponding to the differential mode signal lines, whereby the grounding layer and the differential mode signal lines form a first capacitive coupling therebetween; and the grounding surface of the substrate including a grounding pattern structure aligned with and corresponding to opposing the high-frequency connection pads and the grounding pattern structure being electrically connected to the grounding layer and forming, with respect to the high-frequency connection pads of the connector, a second capacitive coupling that matches the first capacitive coupling.