发明名称 HEAT DISSIPATION STRUCTURE, FABRICATING METHOD, AND ELECTRONIC APPARATUS
摘要 Disclosed is a heat dissipation structure that includes a plurality of linear structures made of carbon, each of the linear structures having at least one of a first end and a second end being bent, and a coating layer formed on a surface of each of the linear structures, the coating layer having a part covering the other one of the first ends and the second ends of the linear structures, a thickness of the part allowing the corresponding linear structures to be plastically deformable.
申请公布号 US2016086872(A1) 申请公布日期 2016.03.24
申请号 US201514956085 申请日期 2015.12.01
申请人 FUJITSU LIMITED 发明人 Sakita Yukie;Yamaguchi Yoshitaka
分类号 H01L23/373;H01L23/31;F28F21/02;H05K7/20;B23P15/26;C23C16/455;C23C16/40;H01L23/367;F28F13/18 主分类号 H01L23/373
代理机构 代理人
主权项 1. A heat dissipation structure comprising: a plurality of linear structures made of carbon, each of the linear structures having at least one of a first end and a second end being bent; and a coating layer formed on a surface of each of the linear structures, the coating layer having a part covering the other one of the first ends and the second ends of the linear structures, a thickness of the part allowing the corresponding linear structures to be plastically deformable.
地址 Kawasaki-shi JP