发明名称 |
IMAGE SENSOR BENDING USING TENSION |
摘要 |
Techniques for fabricating an image sensor chip having a curved surface include placing a bending substrate on a first surface of an imaging sensor chip. The first surface of the imaging sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes bending the bending substrate so as to impart forces on the image sensor chip to produce a curved imaging sensor chip. A second surface of the curved imaging sensor chip may be adhered to a backside substrate. The second surface is opposite the first surface. The bending substrate may be removed from the first surface of the imaging sensor chip. |
申请公布号 |
WO2016044039(A1) |
申请公布日期 |
2016.03.24 |
申请号 |
WO2015US49276 |
申请日期 |
2015.09.10 |
申请人 |
MICROSOFT TECHNOLOGY LICENSING, LLC |
发明人 |
GUENTER, BRIAN K. |
分类号 |
H04N5/369;H01L27/146 |
主分类号 |
H04N5/369 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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