| 摘要 |
The invention relates to a device for the remote laser machining of at least one workpiece (2) by means of a machining laser beam (3), comprising a laser-guiding unit (4) and at least one sensor unit (14) optically decoupled from the laser-guiding unit (4), which laser-guiding unit and sensor unit can be jointly moved by a manipulator (5), in particular around and/or along a plurality of manipulator axes, and/or in relation to which laser-guiding unit and sensor unit the workpiece (2) can be moved by means of a manipulator, in particular around and/or along a plurality of manipulator axes, wherein the machining laser beam (3) can be guided to a process location (8) on the workpiece (2) by means of the laser-guiding unit (4) and the sensor unit (14) has an optical sensor (19) for sensing an analysis region (17) on the workpiece (2) and means for moving the analysis region (17) in relation to the motion of the manipulator (5) and/or of the workpiece (2). According to the invention, the sensor unit (14) has, as means for moving the analysis region, at least one optical, in particular at least partially reflective, guide element (20), which is arranged in the beam path (21) between the analysis region (17) and the sensor (19) and which can be moved in such a way that the position of the analysis region (17) on the workpiece (2) can be changed by means of a relative motion superposed on the manipulator motion and/or workpiece motion. |
