APPARATUS OF INSPECTING RESISTIVE DEFECTS OF SEMICONDUCTOR DEVICES AND INSPECTING METHOD USING THE SAME

摘要

A method of inspecting a resistive defect of a semiconductor device is provided. The method includes loading a semiconductor wafer on a wafer stocker, transferring the semiconductor wafer into a laser anneal module, annealing a portion of the semiconductor wafer using a laser beam in an atmospheric pressure, transferring the annealed semiconductor wafer into an E-beam scanning module in a vacuum, scanning the annealed portions of the semiconductor wafer with an E-beam, and collecting secondary electrons emitted from the annealed portions of the semiconductor wafer.

主权项

1. A method of inspecting a resistive defect of a semiconductor device, comprising:
loading a semiconductor wafer on a wafer stocker; transferring the semiconductor wafer into a laser anneal module using a transfer module; annealing a portion of the semiconductor wafer using a laser beam in an atmospheric pressure; transferring the annealed semiconductor wafer into an E-beam scanning module using the transfer module; scanning the annealed portion of the semiconductor wafer with an E-beam in a vacuum; and collecting secondary electrons emitted from the annealed portion of the semiconductor wafer.