| 发明名称 |
Mold for Manufacturing LED Mounting Substrate |
| 摘要 |
A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die. |
| 申请公布号 |
US2016082631(A1) |
申请公布日期 |
2016.03.24 |
| 申请号 |
US201514956490 |
申请日期 |
2015.12.02 |
| 申请人 |
Lextar Electronics Corporation |
发明人 |
Chen Shing-Kuo;Ko Bo-Yu;Lin Hsiu-Hsiang |
| 分类号 |
B29C45/02;H01L33/00;B29C45/14 |
主分类号 |
B29C45/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mold for manufacturing an LED mounting substrate, comprising:
a first molding die; and a second molding die covering the first molding die, wherein the second molding die comprises:
a material holding tank;a pressing part protruded on the material holding tank, the pressing part expanding along a direction from the first molding die to the second molding die; anda material inlet channel connected between one of outer walls of the second molding die and the material holding tank, the material inlet channel shrinking along a direction from the first molding die to the second molding die. |
| 地址 |
Hsinchu TW |
